Scientific scope
ELISA 2026 spans the full landscape of electron-based science and technology, from the fundamental processes that govern electron–matter interaction to the instruments and applications that translate this understanding into imaging, patterning, and nanomanufacturing.
By merging the traditions of LE2AP+LEELIS and BEACON, the meeting creates a unified space where modelling, experiments, and instrumentation converge – bridging physics and fabrication, materials and devices, and concepts and implementation. This perspective maintains the LE2AP+LEELIS legacy while opening pathways to multi-material, hybrid 3D nanostructures central to BEACON’s focus.
Goals & relevance
Rapid advances in beam technologies, resist materials & precursors, and data- / feedback-driven control are redefining how we understand and exploit electron-matter interactions. By combining the complementary strengths of LEELIS and BEACON, ELISA 2026 provides a timely platform to align fundamental knowledge with technological innovation across research and industry.
The meeting fosters dialogue between basic science and applications, strengthens bridges across core disciplines, and promotes shared terminology and benchmarking. It encourages collaboration among academia, industry, and instrument developers, offers visibility and networking for early-career researchers, and helps shape a collective vision for next-generation electron-based science and technology.
Scientific significance
The topics below are representative rather than exhaustive. Related or emerging concepts in electron-based science, lithography, imaging, and nanomanufacturing are equally welcome.
- Fundamentals of Electron–Matter Interaction
- Generation of electrons in photon-, electron-, ion-, or atom-beam environments
- Transport, absorption, scattering, and energy dissipation in solids and soft matter
- Chemical reactions, cross-linking, charging, and damage mechanisms in precursors, resists, thin films, and prefinished structures (e.g. FEBID / FIBID)
- Theory, modelling and simulation of electron- or ion-induced processes
- Methods & Instrumentation
- Electron beam lithography, focused e-beam induced processing (FEBIP), ion beam, atom beam and Extreme Ultraviolet Lithography (also beyond EUV), X-ray lithography
- Advanced beam sources, novel ion sources / detector types, and multi-beam systems
- Low-voltage and high-resolution electron microscopy (e.g. LEEM, SEM, STEM, CDSEM)
- In situ, in-operando, and cryo-based platforms for soft and hybrid materials
- In situ and correlative spectroscopy (e.g. photoemission, IR, RGA, MS, tomography)
- Hybrid instrumentation combining electrons, ions, and photons for multimodal analysis
- Hybrid preparation approaches in micro- / nanomanufacturing (e.g. FEBID & CVD, subtractive/additive/modification workflows)
- Deterministic implantation and single-ion delivery techniques
- Automation, AI-assisted data acquisition, advanced beam control, and closed-loop process optimization
- Applications & Nanomanufacturing
- Electron, ion, and photon lithography (e.g. EUVL, EBL, FIBID, FEBID, X-ray, ion/atom beam)
- Patterning on photosensitive thin film materials, including for high volume manufacturing
- Direct-write, site-specific, additive nanomanufacturing from 0D to fully 3D architectures including multi-material systems
- Localized property engineering and irradiation-induced modification of materials
- Functional nanostructures for electronics, superconductivity, magnetism, quantum technologies, optics, actuators, and sensing
- Correlative imaging and multimodal analysis of fabricated structures
- Localized repair strategies and integration of beam-based fabrication into industrial and scientific environments